Carbon Dioxide in Argon
Mixture gas of CO2/Ar is a compressed gas, does not support combustion, cylinder containers are easy to overpressure when heated, and there is danger of explosion. It is used as a welding gas.
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Mixture gas of CO2/Ar is a compressed gas, does not support combustion, cylinder containers are easy to overpressure when heated, and there is danger of explosion. It is used as a welding gas.
The mixture gas of diborane and hydrogen is mainly used as dopant for gaseous impurity source, ion implantation and boron doping oxidation diffusion.
The Mixture gas of neon, krypton and fluorine is used in 8 “, 12 “semiconductor factory chip manufacturing.
The mixture gas of argon and hydrogen is as a protective atmosphere for the heat treatment of certain metals, particularly those which are susceptible to nitriding when treated in a nitrogen-based atmosphere. This includes stainless steels and many different specialized and therefore small-scale applications.
The mixture gas of hydrogen and nitrogen is flammable gas, may explode when heated. It mainly used in X-ray fluorescence spectrometer, electronic detector and other instruments, laboratory research, etc..
The Mixture gas of neon and krypton is used in 8 “, 12 “semiconductor factory chip manufacturing.
The mixture gas of helium and oxygen is used as breathing gas for divers who must work at great depths and therefore high pressures. The use of helium to dilute the oxygen instead of nitrogen, as in air, prevents nitrogen being dissolved in the blood, which is the cause of nitrogen narcosis (also known as “bends”).
Purified oxygen and pure nitrogen mix to get synthetic air, which eliminates all kinds of impurities in the normal ambient air. It can be not only used for the breathing of animals and plants, combustible combustion, but also for better use in medical treatment, environment and detection industries.
Chemical Name Oxygen Nitrous Oxide Chemical Formula O2 N2O CAS No. 7782-44-7 10024-97-2 Emergency Measures Label elements Signal word: Danger
The mixture of 80% CF4 gas with 20% O2 gas can be widely used in the surface cleaning of electronic components, solar cells, laser technology and other fields.
Phosphorane is an important n-type doped source in semiconductor device manufacturing, and it is also used in polysilicon chemical vapor deposition, epitaxial GaP material, ion implantation process, MOCVD process, phosphorous silicon glass (PSG) passivation film preparation and other processes.
The mixture gas of hydrogen and silane is flammable gas, may explode when heated. It mainly used in X-ray fluorescence spectrometer, electronic detector and other instruments, laboratory research, etc..
The mixture gas of nitrogen and silane is flammable gas, may explode when heated. It mainly used in X-ray fluorescence spectrometer, electronic detector and other instruments, laboratory research, etc.
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