Semiconductor Manufacturing
Etching Process: Used as a selective etchant for silicon wafers and compound semiconductors, enabling precise control of etching depth and verticality, suitable for integrated circuits (ICs), chips, and other advanced device fabrication.
Surface Cleaning: Removes oxides, organic residues, and metallic contaminants from semiconductor surfaces to ensure accuracy in subsequent processes.
Doping Process: Adjusts the electrical properties of semiconductor materials through hydrogen bromide doping, optimizing device conductivity.