Hexachlorodisilane

Hexachlorodisilane, also known as hexachlorodisilane or disilicon hexachloride, is a colorless liquid with high stability and low volatility. It reacts violently upon contact with water and is insoluble in alcohols and strong alkalis.

As a member of the chlorosilane family, HCDS represents one of the high-value oligomeric chlorosilanes. It serves as an important intermediate in organic synthesis and is widely utilized for the preparation of disilanes and related compounds.

Beyond its role in chemical synthesis, HCDS is increasingly applied in thin film manufacturing, semiconductor processes, and the solar energy industry, making it a critical material in advanced electronic and energy applications.

Process

Hexachlorodisilane (HCDS) is commonly recovered and purified as a by-product or exhaust gas from polysilicon production processes. At Jinhong, low-purity HCDS is procured externally and further purified through fractional distillation, with strict control of moisture throughout the system as the key to ensuring product quality. Currently, Jinhong’s annual production capacity of 4N5 (99.995%) high-purity HCDS reaches 50 tons.
Liquid Gas Hexachlorodisilane
CAS No. 13465-77-5
Purity based on metal ions ≥99.9999%
Hydrogen chloride(HCl) <0.1%
Pentachlorodisilane(PCDS) <0.1%
Hexachlorosiloxane(OTCS) <0.1%
Octachlorotrisilane(HCDSO) <0.1%
Silicon tetrachloride(SiCl4) <0.1%
0.1μm particles <200.0 cts/mL
0.2μm particles <50.0 cts/mL
0.3μm particles <10.0 cts/mL
0.5μm particles <8.0 cts/mL

Applications

Semiconductors and Electronics

Used as a precursor for Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) to deposit high-quality films such as silicon oxide and silicon nitride. High-purity products (>99%) are primarily applied in semiconductor manufacturing and solar cells.

Organic Synthesis and Materials

Serves as an efficient deoxygenation reagent, for example, converting phosphorus oxides into the corresponding phosphines.

Other Applications

Also employed in the synthesis of silica aerogels (used as encapsulants and thermal insulators) and as a precursor in the production of ethylsilane.

Frequently Asked Question

What product specifications can you provide?

Cylinder: 5 gallons Valve: 1/4″ VCR Filling Weight: 20 kg

How should this product be safely stored and handled?

Storage: Must be kept in a cool (recommended below 5°C or 15°C), dry environment. Always store under an inert gas atmosphere (e.g., nitrogen or argon) and ensure the container is tightly sealed. Use corrosion-resistant storage vessels and keep away from water, oxidizers, acids, bases, and other incompatible substances. Handling: Only trained personnel should operate. Wear full personal protective equipment (PPE), including chemical safety goggles, gas mask/respirator, protective gloves, and protective clothing. Fire Extinguishing Media: Use dry sand, dry powder, or carbon dioxide extinguishers. Do not use water.

What are the advantages of using Hexachlorodisilane (HCDS) in the semiconductor industry?

Superior Film Deposition Performance: Lower process temperatures, faster deposition rates, and excellent self-limiting behavior (especially in ALD processes). Suitable for CVD and ALD applications to produce high-quality silicon nitride (Si₃N₄) and silicon oxide (SiO₂) films. Compatibility with Advanced Nodes: Meets the requirements for 28 nm and below logic chips as well as DRAM and NAND Flash manufacturing, primarily used in 12-inch semiconductor production lines. Excellent Material Properties: High stability, low volatility, and serves as a critical silicon source precursor.

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