Our Main Gases

Hydrogen (6N)

Hydrogen is a colorless, odorless, flammable gas and the lightest known gas. Hydrogen is generally non-corrosive, but at high pressures and temperatures, hydrogen can cause embrittlement in some steel grades. Hydrogen is non-toxic, but not life-sustaining, it is a suffocating agent.

High purity hydrogen finds widespread usage in the electronics industry as a reducing agent and as a carrier gas.

Nitrogen

Nitrogen is used in large quantities in the chemical industry for blanketing, purging and pressure transfer of flammable chemicals.

High purity nitrogen is used in large quantities by the semiconductor industry as a purge or carrier gas as well as for blanketing equipment such as furnaces when not in production.

Nitrogen is a colorless, odorless, tasteless and non-toxic inert gas. Liquid nitrogen is colorless. The relative density of gas at 21.1℃ and 101.3kPa is 0.967. Nitrogen is not flammable. It can combine with some particularly active metals such as lithium and magnesium to form nitrides, and can also combine with hydrogen, oxygen and other elements at high temperatures. Nitrogen is a simple asphyxiant.

Nitrogen (3N)

Nitrogen is used in large quantities in the chemical industry for blanketing, purging and pressure transfer of flammable chemicals.

High purity nitrogen is used in large quantities by the semiconductor industry as a purge or carrier gas as well as for blanketing equipment such as furnaces when not in production.

Nitrogen is a colorless, odorless, tasteless and non-toxic inert gas. Liquid nitrogen is colorless. The relative density of gas at 21.1℃ and 101.3kPa is 0.967. Nitrogen is not flammable. It can combine with some particularly active metals such as lithium and magnesium to form nitrides, and can also combine with hydrogen, oxygen and other elements at high temperatures. Nitrogen is a simple asphyxiant.

Nitrogen (5N)

Nitrogen is used in large quantities in the chemical industry for blanketing, purging and pressure transfer of flammable chemicals.

High purity nitrogen is used in large quantities by the semiconductor industry as a purge or carrier gas as well as for blanketing equipment such as furnaces when not in production.

Nitrogen is a colorless, odorless, tasteless and non-toxic inert gas. Liquid nitrogen is colorless. The relative density of gas at 21.1℃ and 101.3kPa is 0.967. Nitrogen is not flammable. It can combine with some particularly active metals such as lithium and magnesium to form nitrides, and can also combine with hydrogen, oxygen and other elements at high temperatures. Nitrogen is a simple asphyxiant.

Nitrous Oxide

Depending on its purity, nitrous oxide (often called “laughing gas”) is widely used in the food, medical, and semiconductor industries.

Jinhong Gas has greatly improved the purity and production capacity of nitrous oxide through continuous technological updates, and is one of the outstanding suppliers in the semiconductor field.

Nitrous oxide may be used as an aerosol propellant in various fields:

-for whipped cream (because it improves the foaming characteristics of the cream), syrups, concentrates of coffee, chocolate and various flavours, sauces for grilled meats, vinaigrette etc. -pharmaceutical field

-cosmetics (perfumes, eau de cologne, hair spray, etc.)

-household products, paints and varnishes, insecticides

-aerosols for use at low temperature, such as de-icers, engine starting boosters, etc.

Nitrous Oxide (5.5N)

Depending on its purity, nitrous oxide (often called “laughing gas”) is widely used in the food, medical, and semiconductor industries.

Jinhong Gas has greatly improved the purity and production capacity of nitrous oxide through continuous technological updates, and is one of the outstanding suppliers in the semiconductor field.

Nitrous oxide may be used as an aerosol propellant in various fields:

-for whipped cream (because it improves the foaming characteristics of the cream), syrups, concentrates of coffee, chocolate and various flavours, sauces for grilled meats, vinaigrette etc. -pharmaceutical field

-cosmetics (perfumes, eau de cologne, hair spray, etc.)

-household products, paints and varnishes, insecticides

-aerosols for use at low temperature, such as de-icers, engine starting boosters, etc.

Octafluorocyclobutane

Octafluorocyclobutane has stable chemical properties, non-toxic and harmless, low global warming potential (GWP) value and zero ozone depletion index (ODP) value. It is a green and environmentally friendly special gas. Due to these good properties, octafluorocyclobutane has been widely used in technical fields such as high-voltage insulation, cleaning and etching, and plasma treatment in recent years.

Oxygen

Oxygen is a colorless, odorless, and tasteless gas. The relative density of gas (air=1) is 1.105 at 21.1℃ and 101.3kPa, and the density of liquid is 1141kg/m3 at the boiling point. Oxygen is not toxic, but exposure to high concentrations of oxygen can have adverse effects on the lungs and central nervous system. Oxygen can be shipped as a non-liquefied gas at a pressure of 13790kPa or as a cryogenic liquid.

Many oxidation reactions in the chemical industry use pure oxygen rather than air in order to benefit from higher reaction rates, easier product separation, higher yields, or smaller equipment size.

Oxygen (2N2)

Oxygen is a colorless, odorless, and tasteless gas. The relative density of gas (air=1) is 1.105 at 21.1℃ and 101.3kPa, and the density of liquid is 1141kg/m3 at the boiling point. Oxygen is not toxic, but exposure to high concentrations of oxygen can have adverse effects on the lungs and central nervous system. Oxygen can be shipped as a non-liquefied gas at a pressure of 13790kPa or as a cryogenic liquid.

Many oxidation reactions in the chemical industry use pure oxygen rather than air in order to benefit from higher reaction rates, easier product separation, higher yields, or smaller equipment size.

Oxygen (5N)

Oxygen is a colorless, odorless, and tasteless gas. The relative density of gas (air=1) is 1.105 at 21.1℃ and 101.3kPa, and the density of liquid is 1141kg/m3 at the boiling point. Oxygen is not toxic, but exposure to high concentrations of oxygen can have adverse effects on the lungs and central nervous system. Oxygen can be shipped as a non-liquefied gas at a pressure of 13790kPa or as a cryogenic liquid.

Many oxidation reactions in the chemical industry use pure oxygen rather than air in order to benefit from higher reaction rates, easier product separation, higher yields, or smaller equipment size.

Silane

Silanes are compounds of silicon and hydrogen, including monosilane (SiH4), disilane (Si2H6), and some higher-order silicon-hydrogen compounds. Among them, monosilane is the most common, and monosilane is sometimes abbreviated as silane. Silane is a colorless, air-reactive and suffocating gas.

Silane (6N)

Silanes are compounds of silicon and hydrogen, including monosilane (SiH4), disilane (Si2H6), and some higher-order silicon-hydrogen compounds. Among them, monosilane is the most common, and monosilane is sometimes abbreviated as silane. Silane is a colorless, air-reactive and suffocating gas.

Sulfur Hexafluoride

One of the principal uses of Sulphur hexafluoride is as an insulating medium in circuit breakers, switch gear, power substations and gas insulated transmission lines. For these applications the gas used must meet or exceed ASTM D272 and IEC specifications.

Tetraethyl Orthosilicate

Ethylsilicate (TEOS) is used as the raw materials used in semiconductor technology deposition can be used for low pressure chemical vapor deposition (LPCVD) the surface of silica in SiC wafers deposits, ensure the density of the oxide layer medium and SiC wafers adhesion ability, improve the performance of the device and yield, and avoided in order to obtain a certain thickness of oxide layer of the shortcomings of long time high temperature oxidation.

Tetraethyl Orthosilicate (9N)

Ethylsilicate (TEOS) is used as the raw materials used in semiconductor technology deposition can be used for low pressure chemical vapor deposition (LPCVD) the surface of silica in SiC wafers deposits, ensure the density of the oxide layer medium and SiC wafers adhesion ability, improve the performance of the device and yield, and avoided in order to obtain a certain thickness of oxide layer of the shortcomings of long time high temperature oxidation.

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