Abstract: Chemical Vapor Deposition (CVD), abbreviated as CVD, is a commonly used technique for thin film fabrication, playing a significant role in the field of materials science and engineering. In the CVD process, carbon monoxide (CO) serves as an important precursor molecule and finds wide applications in thin film growth and material synthesis. This article will focus on the primary role of carbon monoxide in the growth process of metal thin films during CVD. Carbon monoxide (CO) possesses high volatility and decomposability, allowing it to rapidly enter the reaction system and undergo decomposition reactions under appropriate temperature conditions, generating free carbon and oxygen atoms. This characteristic makes carbon monoxide an important choice

Silane is a crucial chemical compound with wide-ranging applications in the semiconductor industry, particularly in lithography processes. Lithography is a key step in chip and integrated circuit manufacturing, where a photosensitive layer, known as photoresist, is used to define patterns and structures on the chip. Silane gas plays a vital role in improving the adhesion between the photoresist and the wafer surface, ensuring precise pattern transfer and enabling high-precision chip fabrication. Silane’s ability to enhance adhesion facilitates accurate pattern definition and replication during the lithography process, ultimately contributing to the production of high-quality semiconductor devices. During the lithography process, photoresist is coated onto the surface of a silicon wafer to

Silane refers to a group of chemical compounds consisting of silicon and hydrogen atoms (SiH4). It is a colorless and flammable gas, characterized by its distinctive pungent odor. Silane is highly reactive due to the presence of the silicon-hydrogen bonds, making it an essential building block for a wide range of chemical processes. Silane(silane gas or liquid silane) plays a crucial role in CMOS (Complementary Metal-Oxide-Semiconductor) technology, encompassing various key steps such as surface treatment, thin film deposition, and cleaning. In this article, we will explore the detailed application of silane in CMOS technology, focusing on its role in improving transistor performance and reliability. Let’s delve into the versatile applications of silane in

Ultra-pure ammonia gas is a highly pure gas, typically used in the electronic technology applications of the semiconductor manufacturing industry. Ultra-pure ammonia gas has a purity of over 99.999% and is prepared through specialized manufacturing processes such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). This highly pure gas is essential for electronic technology applications in the semiconductor industry. Ultra-pure ammonia gas is widely used in the electronic semiconductor technology field and is one of the important chemical gases in the semiconductor industry. It is mainly used in the manufacturing of silicon wafers, which is a critical step in the photolithography process. In the photolithography process, ultra-pure ammonia gas can

According to media reports, the Suwon District Court in South Korea recently sentenced a former researcher at SEMES to four years in prison for illegally obtaining patent technology related to the company’s semiconductor cleaning equipment and using this technology to manufacture similar tools for export to China. In the semiconductor industry, high-purity (electronic-grade) carbon dioxide is mainly used for cleaning technology and immersion lithography. With the increasing number of cleaning procedures in Fab factories, the demand for high-purity (electronic-grade) carbon dioxide in China will also increase in the future. Chip cleaning used to be simply immersing the chip in a cleaning solution. However, from FinFET to GAA structure, advanced DRAM and 3D-NAND,

8. Chlorination     The process of replacing hydrogen atoms in organic compounds with chlorine atoms is called chlorination. Such as using methane to make methane chloride, benzene chlorination to make chlorobenzene, etc. Commonly used chlorinating agents are: liquid or gaseous chlorine, gaseous hydrogen chloride and various concentrations of hydrochloric acid, phosphoric acid chlorine (phosphorus oxychloride), phosphorus trichloride (acyl chloride used to make organic acids), sulfuryl chloride (dichlorosulfur acyl), hypochlorite, etc. Hazard analysis and fire prevention points in the chlorination process:     (1) The fire hazard of the chlorination reaction is mainly determined by the nature of the chlorinated substance and the conditions of the reaction process. Most of the raw materials used in the reaction process are organic