Ultra-pure ammonia gas is a highly pure gas, typically used in the electronic technology applications of the semiconductor manufacturing industry. Ultra-pure ammonia gas has a purity of over 99.999% and is prepared through specialized manufacturing processes such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). This highly pure gas is essential for electronic technology applications in the semiconductor industry. Ultra-pure ammonia gas is widely used in the electronic semiconductor technology field and is one of the important chemical gases in the semiconductor industry. It is mainly used in the manufacturing of silicon wafers, which is a critical step in the photolithography process. In the photolithography process, ultra-pure ammonia gas can

According to media reports, the Suwon District Court in South Korea recently sentenced a former researcher at SEMES to four years in prison for illegally obtaining patent technology related to the company’s semiconductor cleaning equipment and using this technology to manufacture similar tools for export to China. In the semiconductor industry, high-purity (electronic-grade) carbon dioxide is mainly used for cleaning technology and immersion lithography. With the increasing number of cleaning procedures in Fab factories, the demand for high-purity (electronic-grade) carbon dioxide in China will also increase in the future. Chip cleaning used to be simply immersing the chip in a cleaning solution. However, from FinFET to GAA structure, advanced DRAM and 3D-NAND,

8. Chlorination     The process of replacing hydrogen atoms in organic compounds with chlorine atoms is called chlorination. Such as using methane to make methane chloride, benzene chlorination to make chlorobenzene, etc. Commonly used chlorinating agents are: liquid or gaseous chlorine, gaseous hydrogen chloride and various concentrations of hydrochloric acid, phosphoric acid chlorine (phosphorus oxychloride), phosphorus trichloride (acyl chloride used to make organic acids), sulfuryl chloride (dichlorosulfur acyl), hypochlorite, etc. Hazard analysis and fire prevention points in the chlorination process:     (1) The fire hazard of the chlorination reaction is mainly determined by the nature of the chlorinated substance and the conditions of the reaction process. Most of the raw materials used in the reaction process are organic

4. Electrolysis     When electric current passes through electrolytic solution or molten electrolyte, the chemical change caused on two poles is called electrolysis. Electrolysis has a wide range of functions in industry. The smelting of many non-ferrous metals (sodium, potassium, magnesium, lead, etc.) and rare metals (zirconium, hafnium, etc.), the refining of metal copper, zinc, aluminum, etc., as well as the preparation and electroplating, electropolishing, anodic oxidation, etc. of many basic chemical industry products (Hydrogen, oxygen, chlorine, caustic soda, potassium chlorate, hydrogen peroxide, etc.) are all realized by electrolysis.     Such as salt water electrolysis production sodium hydroxide, hydrogen, chlorine, electrolysis water production, etc. Risk analysis and fire prevention points in the

1. Oxidation Such as ammonia oxidation to nitric acid, toluene oxidation to benzoic acid, ethylene oxidation to ethylene oxide, etc.     (1) Fire risk of oxidation     ①Oxidation reaction requires heating, but heat will also be released during the reaction, especially the catalytic gas phase reaction. Generally, the oxidation reaction will be carried out at a high temperature of 250-600 ℃. If the heat generated by the reaction is not removed in time, the temperature will rise rapidly or even explode.     ② For some oxidations, such as the oxidation of ammonia, ethylene and methanol vapor in the air, the material ratio is close to the lower explosion limit. If the ratio is out of

HF Wastewater Process Fluorine and Ammonia Wastewater Process Ammonia nitrogen wastewater process CMP Wastewater Process Copper Wastewater Process Domestic sewage treatment system process Acid-base wastewater process